L. Menk

发表

Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection

J. Bower, N. Jackson, M. Jordan, 2021 .

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

T. Moffat, D. Josell, P. Yeh, 2018, Journal of the Electrochemical Society.

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

T. Moffat, D. Josell, M. Blain, 2020, Journal of the Electrochemical Society.

Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

J. Dominguez, M. Blain, A. Hollowell, 2018, Journal of The Electrochemical Society.

Tutorial on forming through-silicon vias

S. Burkett, M. Jordan, A. Hollowell, 2020 .