M. Marunaka

Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform

Taro Hayashi, M. Yokoi, K. Kondo, 2013 .

Small diameter via filling electrodeposition by periodical reverse current

Taro Hayashi, M. Yokoi, K. Kondo, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Preliminary Experiments of Cu Interconnect Preparation by Magnetically Transported-Shielded Cathodic Arc Deposition

H. Takikawa, T. Sakakibara, T. Doi, 2003 .

High-aspect ratio copper-via filling for three dimensional chip stacking

Naoki Okamoto, Takeyasu Saito, Masao Marunaka, 2009, 2009 59th Electronic Components and Technology Conference.