Yu-Xi Wang

Effect of pulse off time on microstructure and properties of twinned copper films by pulse electrodeposition

Li-Yin Gao, Zhi-Quan Liu, Rong Sun, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Thermal stability of electroplated Cu films with different microstructure by annealing treatment

Li-Yin Gao, Zhi-Quan Liu, N. Zhao, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding

Li-Yin Gao, Yu-Xi Wang, Minghui Zhang, 2023, Applied Surface Science.