Soo-bok Chin

发表

Experimental methodology of contact edge roughness on sub-100-nm pattern

Byoung-Ho Lee, Kyoung Mo Yang, Tae Yong Lee, 2004, SPIE Advanced Lithography.

Electrical defect SEM review under the various electric circumstances on SAC layer

Jeong-Ho Yeo, Byoung-Ho Lee, Tae Yong Lee, 2004, SPIE Advanced Lithography.

Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Byoung-Ho Lee, Soo-bok Chin, Do-Hyun Cho, 2007, SPIE Advanced Lithography.

Methodology and mechanism study on high aspect ratio (HAR) contact bottom image in scanning electron microscopy

Jeongyeon Lim, Byoung Hun Lee, Tae Yong Lee, 2005, SPIE Advanced Lithography.

Defect distribution study at through silicon via (TSV) bottom by scanning white-light interference microscopy

Timothy A. Johnson, Byoung-Ho Lee, Ho-Kyu Kang, 2012, Advanced Lithography.

Characterization analysis study of μ-bridge defect using simulation and wafer inspection tools

Luca Grella, Soo-bok Chin, Chang-lyong Song, 2005, SPIE Advanced Lithography.

Accelerating litho technology development for advanced design node flash memory FEOL by next-generation wafer inspection and SEM review platforms

Byoung-Ho Lee, Ho-Kyu Kang, Rahul Lakhawat, 2012, Advanced Lithography.

Highly effective and accurate weak point monitoring method for advanced design rule (1x nm) devices

Mingwei Li, Raghav Babulnath, Chang Ho Lee, 2014, Advanced Lithography.

Optical analysis on the wafer defect inspection for yield enhancement

Byoung-Ho Lee, Ho-Kyu Kang, Jeong-Ho Ahn, 2013, Advanced Lithography.

Optical characterization of defects on patterned wafers: exploring light polarization

Jeong-Ho Yeo, Byoung-Ho Lee, Silviu Reinhorn, 2004, SPIE Advanced Lithography.