Young-Doo Jeon

发表

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Kyung-Wook Paik, Soon-Bok Lee, Se Young Yang, 2006, Microelectron. Reliab..

90nm node contact hole patterning through applying model based OPC in KrF lithography

Sang Uk Lee, Jae-Young Choi, Jeahee Kim, 2008, SPIE Advanced Lithography.

Line width variation with absorber thickness in extreme ultraviolet lithography

Hye-Keun Oh, Eun Jin Kim, Min-Ki Choi, 2005, SPIE Advanced Lithography.

Microwave frequency model of flip-chip interconnects using anisotropic conductive film

Seungyoung Ahn, Woong Hwan Ryu, Yong-Hee Lee, 1999 .

Enhanced hole shape of flash devices in ArF lithography by eliptical mask bias technique

Sang Uk Lee, Jae-Hyun Kang, Keeho Kim, 2007, SPIE Advanced Lithography.

Stresses in electroless Ni-P films for electronic packaging applications

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2002 .

Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

Reduction of the absorber shadow effect by changing the absorber side wall angle in extreme ultraviolet lithography

Hye-Keun Oh, Young-Doo Jeon, Myoung-Sul Yoo, 2005 .

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

Young-Doo Jeon, Kyung-Wook Paik, Myung Jin Yim, 2000 .

Thin electroless Cu/OSP on electroless Ni as a novel surface finish for flip chip solder joints

Young-Sik Choi, Young-Doo Jeon, Yong-Bin Lee, 2006, 56th Electronic Components and Technology Conference 2006.

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

H. Reichl, Sabine Nieland, Young-Doo Jeon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999 .