Yi-Wun Wang

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding

Yi-Shao Lai, Jiunn Chen, Yi-Wun Wang, 2011, Microelectron. Reliab..

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Yi-Wun Wang, C. Robert Kao, Y. W. Lin, 2009, Microelectron. Reliab..