Daoguo Yang

发表

Dongji Xie, Miao Cai, Nanbo Li, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Miao Cai, Wenbin Chen, Daoguo Yang, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Junsheng Liang, Daoguo Yang, Yubing Gong, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
Daoguo Yang, Wanchun Tian, 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).
Daoguo Yang, Dongjing Liu, Rongbin Ren, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Guoqi Zhang, Miao Cai, Minghui Yun, 2019, IEEE Access.
Ping Zhang, Miao Cai, Weihai Zhang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Xiaosong Ma, Daoguo Yang, G.Q. Zhang, 2007, 2007 8th International Conference on Electronic Packaging Technology.
Lianfa Yang, Kailin Pan, Daoguo Yang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Ping Zhang, Miao Cai, Han Lu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Zhen Zhang, Miao Cai, Daoguo Yang, 2012, 2012 2nd IEEE CPMT Symposium Japan.
Qiang Liu, Weidong Hao, Daoguo Yang, 2018, 2018 IEEE 4th Information Technology and Mechatronics Engineering Conference (ITOEC).
Song Wu, Miao Cai, Xiang Wan, 2015, 2015 IEEE International Conference on Mechatronics and Automation (ICMA).
Daoguo Yang, Rachmad Andri Atmoko, R. A. Atmoko, 2018, 2018 IEEE International Conference on Robotics, Biomimetics, and Intelligent Computational Systems (Robionetics ).
Lei Liu, Fengze Hou, G.Q. Zhang, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W.D. van Driel, F. Theunis, J. Bielen, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Miao Cai, Daoguo Yang, Kunmiao Tian, 2014, 2014 15th International Conference on Electronic Packaging Technology.
Daoguo Yang, Daoguo Yang, Zaifu Cui, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Fengze Hou, G.Q. Zhang, Daoguo Yang, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Xuejun Fan, Jianlin Huang, Sau Koh, 2015, IEEE Transactions on Device and Materials Reliability.
W.D. van Driel, Daoguo Yang, Dongjing Liu, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Miao Cai, Daoguo Yang, Wanchun Tian, 2012 .
Lei Liu, Fengze Hou, Kailin Pan, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Miao Cai, Daoguo Yang, Hongyu Tang, 2013, 2013 14th International Conference on Electronic Packaging Technology.
Miao Cai, Daoguo Yang, Lingen Wang, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
Wei He, Miao Cai, Jianna Zheng, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Lei Liu, Fengze Hou, Yang Hai, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.