J. Martin

Optimization of damascene feature fill for copper electroplating process

E. Broadbent, J. Reid, V. Bhaskaran, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Integration of SiCN as a low /spl kappa/ etch stop and Cu passivation in a high performance Cu/low /spl kappa/ interconnect

Ertugrul Demircan, Larry Zhao, Steve Park, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).