W. H. Song

Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test

Michael Mayer, Jae Pil Jung, Il Ho Jeong, 2014, Electronic Materials Letters.

More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Wan Ho Song, Nhat Ly, Di Erick Xu, 2015, Microelectron. Reliab..

Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force

Michael Mayer, Jeong-Tak Moon, Chunjin Hang, 2009 .

Dead-end injection molding of polymeric microcantilever arrays

A. Hierlemann, J. Lichtenberg, W. H. Song, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

A new routine to fabricate Bi single crystalline tapering junction nanowire arrays

Guanghai Li, Yuzhi Zhang, Y. Zhang, 2005 .