Cheng-hsuan Kuo
发表
A. Kummel,
C. Winter,
S. Ueda,
2023,
Applied Surface Science.
J. Spiegelman,
A. Kummel,
V. Wang,
2022,
2022 IEEE International Interconnect Technology Conference (IITC).
A. Kummel,
R. Kanjolia,
V. Wang,
2023,
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM).
G. Pitner,
M. Passlack,
A. Kummel,
2022,
ACS applied materials & interfaces.