Han-Cong Wang

Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration

Zhiming Chen, Lei Xiao, Yingtao Ding, 2022, Micromachines.

Pulsed laser annealing of Be-implanted GaN

L. Tan, E. Chor, Han-Cong Wang, 2005 .