K. Machani

Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling

Dirk Breuer, Jae Kyu Cho, Frank Kuechenmeister, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact

S. Rzepka, B. Michel, J. Auersperg, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact

B. Michel, S. Rzepka, D. Breuer, 2016 .

Chip Package Interaction (CPI) Stress Modeling

Dirk Breuer, Jens Paul, Frank Kuechenmeister, 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

Dirk Breuer, Jens Paul, Frank Kuechenmeister, 2015, 2015 IEEE International Reliability Physics Symposium.

Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading

P. Hofmann, F. Kuechenmeister, D. Breuer, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

Chirag Shah, Dirk Breuer, Shan Gao, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).