Hung Wang

Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles

Wei Liu, A. Wu, Chang-meng Wang, 2021, Journal of the Taiwan Institute of Chemical Engineers.

Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature

K. Cheng, A. Wu, Chang-meng Wang, 2023, Materialia.