Tamal Ghosh

发表

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016 .

Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC

S. Singh, A. Dutta, V. SivaRamaKrishna, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Tamal Ghosh, 2017 .

Surface Density Gradient Engineering Precedes Enhanced Diffusion; Drives CMOS In-Line Process Flow Compatible Cu–Cu Thermocompression Bonding at 75 °C

Asisa Kumar Panigrahy, S. Singh, S. Vanjari, 2019, IEEE Transactions on Device and Materials Reliability.

Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding

S. Singh, S. Vanjari, A. Panigrahi, 2017, IEEE Transactions on Electron Devices.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

S. Singh, S. Vanjari, A. Panigrahi, 2018, Electronic Materials Letters.

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications

S. Singh, S. Vanjari, A. Panigrahi, 2018 .

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration

S. Singh, S. Vanjari, A. Panigrahi, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding

A. Dutta, C. Subrahmanyam, V. SivaRamaKrishna, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration

S. Singh, S. Vanjari, A. Panigrahi, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Copper Protection by SAM and Low Temperature Bonding for 3Dimentional Integration

S. Singh, A. Dutta, Tamal Ghosh, 2013 .

Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs

S. Singh, A. Dutta, C. Subrahmanyam, 2012, 2012 International Conference on Emerging Electronics.

Effect of post deposition annealing on thermal evaporated ZnSe

S. Singh, S. Duttagupta, M. Gandhi, 2014 .

Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

S. Singh, V. Krishna, Tamal Ghosh, 2014, 2014 IEEE 2nd International Conference on Emerging Electronics (ICEE).