C. S. Tan

Temperature and duration effects on microstructure evolution during copper wafer bonding

Kuan-Neng Chen, A. Fan, C. S. Tan, 2003 .

Bonding parameters of blanket copper wafer bonding

Kuan-Neng Chen, A. Fan, C. S. Tan, 2006 .

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

High quality gate dielectrics grown by rapid thermal processing using split-N2O technique on strained-Si/sub 0.91/Ge/sub 0.09/ films

C. Maiti, C.S. Tan, L. Bera, 2001, IEEE Electron Device Letters.