Krishna Tunga

Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations

Krishna Tunga, Thomas Wassick, Luc Guerin, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Suresh K. Sitaraman, Raghuram V. Pucha, Krishna Tunga, 2004 .

Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages

Suresh K. Sitaraman, Krishna Tunga, Andy Perkins, 2006 .

Geometric optimization and mechanical risk mmitigation in 2.5D flip-chip packages using parametric finite element analysis (FEA) simulations

Tuhin Sinha, Krishna Tunga, Shidong Li, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

Suresh K. Sitaraman, Raghuram V. Pucha, Krishna Tunga, 2002 .

An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates

Katsuyuki Sakuma, John Knickerbocker, Krishna Tunga, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).