Ching-Hua Wang

Three-dimensional 4F2 ReRAM cell with CMOS logic compatible process

Meng-Fan Chang, Heng-Yuan Lee, Yu-Sheng Chen, 2010, 2010 International Electron Devices Meeting.

Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications

M. Tsai, Y. King, C. Lin, 2013, 2013 IEEE International Electron Devices Meeting.

Magnetic Wireless Interlayer Transmission Through Perpendicular MTJ for 3-D IC Applications

Ming-Jinn Tsai, Ya-Chin King, Chrong Jung Lin, 2014, IEEE Transactions on Electron Devices.

Three-Dimensional $\hbox{4F}^{2}$ ReRAM With Vertical BJT Driver by CMOS Logic Compatible Process

Heng-Yuan Lee, Ming-Jinn Tsai, Ya-Chin King, 2011, IEEE Transactions on Electron Devices.

Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM

Frederick T. Chen, C. Lin, P. Tzeng, 2008, 2008 IEEE International Electron Devices Meeting.