Toru Kondo

发表

Characterization of 4 Million Micro-Bump Interconnections at 7.6- $\mu \text{m}$ Pitch for 3-D Stacked 16 Million Pixel Image Sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2017, IEEE Transactions on Semiconductor Manufacturing.

A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode and 2Mpixel 10000fps mode using 4 million interconnections

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2015, 2015 Symposium on VLSI Circuits (VLSI Circuits).

Motor vehicle seat with a backrest provided with side supports

Toru Kondo, Shiyozi Mizuno, 1989 .

Reliable 4 million micro bumps at 7.6-um pitch interconnection technology for 3D stacked 16 million pixel image sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2016, 2016 International Conference on Electronics Packaging (ICEP).

A Fundamental Study on the Unsteady Running Characteristics of Pneumatic Capsule: Theoretical analysis and experiment on the continuous transportation system of capsules (2nd Report)@@@非定常状態における空気力カプセルの走行に関する基礎的研究 (第2報)

Toru Kondo, Hideki Ohba, Yukitoshi Nakashima, 1986 .

Short-term Load Forecasting with Fuzzy Optimal Regression Tree

Hiroyuki Mori, Toru Kondo, Kenta Ishiguro, 2001 .

[Paper] A 3D Stacked 16Mpixel Global-shutter CMOS Image Sensor Using 4 Million Interconnections

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2016 .

Multiband Imaging CMOS Image Sensor with Multi-Storied Photodiode Structure †

Yoshiaki Takemoto, Mitsuhiro Tsukimura, Haruhisa Saito, 2018, Sensors.

Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2015 .

PS-10-9 The effect of coil orientation on the reliability of transcranial magnetic stimulation for mapping a cortical representation of the first dorsal interosseus muscle

Toru Kondo, Hiroshi Fujii, Eiji Suzuki, 1995 .

Short-term load forecasting with fuzzy regression tree in power systems

Hiroyuki Mori, Toru Kondo, Kenta Ishiguro, 2001, 2001 IEEE International Conference on Systems, Man and Cybernetics. e-Systems and e-Man for Cybernetics in Cyberspace (Cat.No.01CH37236).

A rolling-shutter distortion-free 3D stacked image sensor with −160dB parasitic light sensitivity in-pixel storage node

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

Technology for Long Distance Live Migration -- Distributed Storage and Network

Kohei Ichikawa, Toru Kondo, Ikuo Nakagawa, 2014 .

A 3D stacked global-shutter image sensor with pixel-level interconnection technology for high-speed image capturing

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2017, International Congress on High-Speed Imaging and Photonics.

Evaluation of P2P Type File Distribution using IP Mobility

Toru Kondo, Kouji Nishimura, Reiji Aibara, 2009 .

A 3 D Stacked 16 Mpixel Global-shutter CMOS Image Sensor Using 4 Million Interconnections

Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, 2016 .

3-D-Stacked 16-Mpixel Global Shutter CMOS Image Sensor Using Reliable In-Pixel Four Million Microbump Interconnections With 7.6- $\mu \text{m}$ Pitch

Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, 2016, IEEE Transactions on Electron Devices.