Yoshitaka Tadaki

Characterization of 4 Million Micro-Bump Interconnections at 7.6- $\mu \text{m}$ Pitch for 3-D Stacked 16 Million Pixel Image Sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2017, IEEE Transactions on Semiconductor Manufacturing.

A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode and 2Mpixel 10000fps mode using 4 million interconnections

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2015, 2015 Symposium on VLSI Circuits (VLSI Circuits).

Reliable 4 million micro bumps at 7.6-um pitch interconnection technology for 3D stacked 16 million pixel image sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2016, 2016 International Conference on Electronics Packaging (ICEP).

[Paper] A 3D Stacked 16Mpixel Global-shutter CMOS Image Sensor Using 4 Million Interconnections

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2016 .

Multiband Imaging CMOS Image Sensor with Multi-Storied Photodiode Structure †

Yoshiaki Takemoto, Mitsuhiro Tsukimura, Haruhisa Saito, 2018, Sensors.

An efficient method to evaluate 4 million micro-bump interconnection resistances for 3D stacked 16-mpixel image sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2016, 2016 International Conference on Microelectronic Test Structures (ICMTS).

A rolling-shutter distortion-free 3D stacked image sensor with −160dB parasitic light sensitivity in-pixel storage node

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

A 3D stacked global-shutter image sensor with pixel-level interconnection technology for high-speed image capturing

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2017, International Congress on High-Speed Imaging and Photonics.

A 3 D Stacked 16 Mpixel Global-shutter CMOS Image Sensor Using 4 Million Interconnections

Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, 2016 .

Physical model of bit-to-bit variation in data retention time of DRAMs

Yoshitaka Tadaki, M. Muranaka, Nobuyoshi Natsuaki, 1995, 1995 53rd Annual Device Research Conference Digest.

3-D-Stacked 16-Mpixel Global Shutter CMOS Image Sensor Using Reliable In-Pixel Four Million Microbump Interconnections With 7.6- $\mu \text{m}$ Pitch

Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, 2016, IEEE Transactions on Electron Devices.