E. Eid

Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

A. Farcy, T. Lacrevaz, B. Flechet, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

P. Leduc, A. Farcy, T. Lacrevaz, 2011 .