H. Fujita

Sub-micron gaps without sub-micron etching

Hiroyuki Fujita, Toshiki Hirano, K. J. Gabriel, 1991, [1991] Proceedings. IEEE Micro Electro Mechanical Systems.

Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

K. Suganuma, Hao Zhang, S. Nagao, 2017 .

Thermal reliability of SiC device with Cu sintering die-attach processed at 250°C in N2 gas

K. Suganuma, Hao Zhang, S. Nagao, 2017 .

High temperature SiC power device realized by electroless plating diffusion barrier for Ag sinter die-attach

K. Suganuma, T. Sugahara, S. Nagao, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Electric Ejection of Viscous Inks From MEMS Capillary Array Head for Direct Drawing of Fine Patterns

Y. Mita, Y. Mita, R. Ohigashi, 2008, Journal of Microelectromechanical Systems.