T. Peng

Panel-Level Chip-Scale Package With Multiple Diced Wafers

J. Lau, C. Ko, Kai-Ming Yang, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

High-Density Hybrid Substrate for Heterogeneous Integration

C. Ko, J. Lau, Kai-Ming Yang, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.