S. Atmur

Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly

S. Bhattacharya, P. Markondeya Raj, R. Doraiswami, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Oxide/Oxide Ceramic Matrix Composite (CMC) Exhaust Mixer Development in the NASA Environmentally Responsible Aviation (ERA) Project

Narottam P. Bansal, J. Douglas Kiser, James Szelagowski, 2015 .