C. van 't Hof

Cure, temperature and time dependent constitutive modeling of moulding compounds

K.M.B. Jansen, G.Q. Zhang, H.J.L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

A novel tool for cure dependent viscoelastic characterization of packaging polymers

K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.