Kyungjun Cho
发表
Hyunwook Park,
Seongguk Kim,
Youngwoo Kim,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Seongsoo Lee,
Dong-Hyun Kim,
Youngwoo Kim,
2019,
IEEE Transactions on Electromagnetic Compatibility.
Joungho Kim,
Kyungjun Cho,
Yunsaing Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Junyong Park,
Subin Kim,
Kyungjun Cho,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Subin Kim,
Kyungjun Cho,
Gapyeol Park,
2018,
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
Yong-Ju Kim,
Joungho Kim,
Kyungjun Cho,
2015,
2015 International 3D Systems Integration Conference (3DIC).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Pulugurtha Markondeya Raj,
Rao Tummala,
2017,
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Yong-Ju Kim,
Joungho Kim,
Kyungjun Cho,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Seongguk Kim,
Joungho Kim,
Subin Kim,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Subin Kim,
Kyungjun Cho,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Seongsoo Lee,
Joungho Kim,
Junyong Park,
2018,
IEEE Transactions on Electromagnetic Compatibility.
Seongsoo Lee,
Joungho Kim,
Junyong Park,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2016,
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Seongsoo Lee,
Seungyoung Ahn,
Dong-Hyun Kim,
2019,
IEEE Transactions on Industrial Electronics.
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2015,
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Subin Kim,
Kyungjun Cho,
2016,
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Junyong Park,
Dong-Hyun Kim,
Joungho Kim,
2018
.
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2015,
2015 International 3D Systems Integration Conference (3DIC).
Joungho Kim,
Subin Kim,
Kyungjun Cho,
2017,
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2016,
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
Seongguk Kim,
Joungho Kim,
Subin Kim,
2019,
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2016
.
Kyungjun Cho,
조경준,
2016
.
Joungho Kim,
Subin Kim,
Kyungjun Cho,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Joungho Kim,
Kyungjun Cho,
Yunsaing Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Youngwoo Kim,
Subin Kim,
Kyungjun Cho,
2017
.
Min Suk Kim,
Joungho Kim,
Kyungjun Cho,
2018,
Microelectron. J..
Joungho Kim,
Kyungjun Cho,
Hyunsuk Lee,
2016,
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Seongguk Kim,
Joungho Kim,
Subin Kim,
2019,
2019 IEEE Asia-Pacific Microwave Conference (APMC).
Joungho Kim,
Seongguk Kim,
Kyungjun Cho,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Seongguk Kim,
Kyungjun Cho,
2021,
IEEE Transactions on Electromagnetic Compatibility.
Joungho Kim,
Kyungjun Cho,
Jinwook Song,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Kyungjun Cho,
Shinyoung Park,
2019,
IEEE Transactions on Electromagnetic Compatibility.
Joungho Kim,
Kyungjun Cho,
Seungtaek Jeong,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Pulugurtha Markondeya Raj,
Kyungjun Cho,
2017,
IEEE Transactions on Electromagnetic Compatibility.
Joungho Kim,
Kyungjun Cho,
Gapyeol Park,
2016,
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Kyungjun Cho,
Jinwook Song,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.