Daehwan Lho
发表
Hyunwook Park,
Seongguk Kim,
Youngwoo Kim,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Seongsoo Lee,
Dong-Hyun Kim,
Youngwoo Kim,
2019,
IEEE Transactions on Electromagnetic Compatibility.
Junyong Park,
Subin Kim,
Kyungjun Cho,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Seongguk Kim,
Daehwan Lho,
2019,
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Seongguk Kim,
Junyong Park,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Junyong Park,
Daehwan Lho,
2018,
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
HyunWook Park,
Joungho Kim,
Youngwoo Kim,
2020
.
Joungho Kim,
Daehwan Lho,
Gapyeol Park,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Daehwan Lho,
Boogyo Sim,
2020,
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Seongguk Kim,
Joungho Kim,
Junyong Park,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Daehwan Lho,
Youngwoo Kim,
2019,
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).
Joungho Kim,
Daehwan Lho,
Gapyeol Park,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2020,
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Joungho Kim,
Seongguk Kim,
Kyungjun Cho,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Seongguk Kim,
Kyungjun Cho,
2021,
IEEE Transactions on Electromagnetic Compatibility.