F. N. Masana

发表

A straightforward analytical method for extraction of semiconductor device transient thermal parameters

F. N. Masana, 2007, Microelectron. Reliab..

Thermal impedance measurements under non-equilibrium conditions. How to extend its validity

F. N. Masana, 2008, Microelectron. Reliab..

The Smartpack(R), a low cost high performance solution for power packaging

F. N. Masana, D. A. Hinchley, M. T. Rahimo, 1999 .

A new approach to the dynamic thermal modelling of semiconductor packages

F. N. Masana, F. Masana, 2001, Microelectron. Reliab..

A closed form solution of junction to substrate thermal resistance in semiconductor chips

F. N. Masana, F. Masana, 1996 .

Thermal characterisation of power modules

F. N. Masana, 2000 .

Innovative low-cost power module

F. N. Masana, D. A. Hinchley, M. T. Rahimo, 2001 .