M. Koch
发表
H. Reichl,
T. Braun,
K.-F. Becker,
2009,
2009 59th Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
K.-F. Becker,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
W. John,
H. Reichl,
K.-F. Becker,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
F. Solzbacher,
Erik Jung,
M. Koch,
2008,
2008 58th Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Herbert Reichl,
K.-F. Becker,
Rolf Aschenbrenner,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
Herbert Reichl,
K.-F. Becker,
Rolf Aschenbrenner,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
Herbert Reichl,
K.-F. Becker,
U. Oestermann,
2002,
4th Electronics Packaging Technology Conference, 2002..
J. Bauer,
T. Braun,
K.-F. Becker,
2014
.
M. Thoben,
M. Koch,
Infineon,
2008
.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..