Yiyi Ma

Challenges for extra large embedded wafer level ball grid array development

Yaohuang Huang, Yonggang Jin, Kim-yong Goh, 2009, 2009 11th Electronics Packaging Technology Conference.

An Auction Mechanism to Maximizing the Quantity of Allocation

Bin Li, Junwu Zhu, Yi Jiang, 2012 .

Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive Applications

Jing-en Luan, Yiyi Ma, Jefferson Talledo, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).