Insu Hwang

Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer

Joungho Kim, Rao Tummala, Jihye Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Noise coupling modeling and analysis of through glass via(TGV)

Joungho Kim, Jonghyun Cho, Youngwoo Kim, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC

Joungho Kim, Rao Tummala, Venky Sundaram, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)

Joungho Kim, Rao Tummala, Venky Sundaram, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).