Yubing Gong

Impact of the design parameters uncertainty on the PC-white LED color constancy based on the theory of the uncertainty

Chao Jin, Yubing Gong, Xianling Zheng, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

Junsheng Liang, Daoguo Yang, Yubing Gong, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

Yubing Gong, Yi Zheng, Yutian Yin, 2021, Soldering & Surface Mount Technology.