T. Wendt
发表
Steven van de Par,
Torben Wendt,
Stephan D. Ewert,
2014
.
Christian Schuster,
Stefano Grivet-Talocia,
Marco De Stefano,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Schuster,
S. Grivet-Talocia,
Cheng Yang,
2020,
IEEE Transactions on Electromagnetic Compatibility.
S. van de Par,
S. Ewert,
Hongmei Hu,
2023,
Journal of the Audio Engineering Society.
Steven van de Par,
Christoph Kirsch,
Torben Wendt,
2021,
2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA).
Steven van de Par,
Christoph Kirsch,
Torben Wendt,
2021,
Trends in hearing.