Seung Mo Kim

Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test

Jin Young Kim, Jae Dong Kim, Seung Mo Kim, 2005 .

Analysis of thermo-physical and optical properties of a diffuser using PET/PC/PBT copolymer in LCD backlight units

Geun-Hyung Kim, Seung Mo Kim, Woo Jun Kim, 2005, Displays.

Efficient Approach to Thermal Modeling for IC Packages

Seung Mo Kim, Choon Heung Lee, 1999 .

A methodology for drop performance prediction and application for design optimization of chip scale packages

Seung Mo Kim, Wei Lin, T. Panczak, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Kim, 2005, IEEE Transactions on Electronics Packaging Manufacturing.

Semi-Lagrangian flow analysis of Viscoelastic fluid using Objective Time Integration

Woo Il Lee, Seung Mo Kim, Sung Yong Kang, 2006 .