A. Geczy

Reducing lead-free soldering failures caused by Printed Circuit Board shrinkage

A. Szabo, B. Illes, A. Geczy, 2013, 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).

Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems

Z. Illyefalvi-Vitez, B. Illes, A. Geczy, 2012, 2012 35th International Spring Seminar on Electronics Technology.

Investigating whisker growth on immersion tin surface finishing

B. Horvath, B. Illes, A. Geczy, 2012, 2012 35th International Spring Seminar on Electronics Technology.

Conductive layer deposition and peel tests on biodegradable printed circuit boards

A. Geczy, I. Hajdu, A. Géczy, 2012, 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME).