J. D. Mis

A minimal CSP

G. A. Rinne, J. D. Walling, J. D. Mis, 2000, ECTC 2000.

Chip scale packaging and redistribution

Glenn A. Rinne, J. D. Mis, P. A. Magill, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

Flip chip overview

Glenn A. Rinne, J. D. Mis, P. A. Magill, 1996, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).

Stress-induced dislocations in silicon integrated circuits

J. D. Mis, P. M. Fahey, S. R. Mader, 1992, IBM J. Res. Dev..

Solder alloy selection for flip chip on board

J. D. Mis, G. Rinne, P. Magill, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

Effects of a stress field on boron ion implantation damage in silicon

J. D. Mis, S. Mader, S. Mader, 1993 .

The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys

D. B. Knorr, Kenneth P. Rodbell, J. D. Mis, 1993 .

Grain Growth in Al-(Cu, Pd, Nb) Thin Films

J. D. Mis, K. Rodbell, 1993 .

Electromigration Behavior in Layered Ti/AlCu/Ti Films and its Dependence on Intermetallic Structure

J. D. Mis, P. Dehaven, K. Rodbell, 1991 .