Y.J. Song

PRAM process technology

S.Y. Lee, J.H. Park, H.S. Jeong, 2004, 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866).

Highly reliable and mass-productive FRAM embedded smartcard using advanced integration technologies

S.Y. Lee, Kinam Kim, J.H. Park, 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..

Process technologies for the integration of high density phase change RAM

S.Y. Lee, Kinam Kim, J.H. Park, 2005, 2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005..

Integration and cell characteristics for high density PRAM

J.H. Park, K.N. Kim, S.J. Ahn, 2004, Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850).

Advanced ring type contact technology for high density phase change memory

S.Y. Lee, K.N. Kim, S.J. Ahn, 2005, Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005..

A FRAM technology using 1T1C and triple metal layers for high performance and high density FRAMs

S.Y. Lee, S.O. Park, Y.J. Song, 1999, 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325).

Highly manufacturable 1T1C 4 Mb FRAM with novel sensing scheme

S.Y. Lee, S.O. Park, Y.J. Song, 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).

Novel integration technologies for highly manufacturable 32 Mb FRAM

S.Y. Lee, S.O. Park, Y.J. Song, 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).