Tien-Yu Lee

Assessment of backside processes through die strength evaluation

B. H. Yeung, V. Hause, Tien-Yu Lee, 2000 .

Analysis of RF MEMS switch packaging Process for yield improvement

L.L. Mercado, Tien-Yu Lee, S.-M. Kuo, 2005, IEEE Transactions on Advanced Packaging.

Design optimization of an integrated liquid-cooled IGBT power module using CFD technique

Tien-Yu Lee, 2000 .

Design optimization of an integrated liquid-cooled IGBT power module using CFD technique

Tien-Yu Lee, T. Lee, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shock

L. L. Mercado, Tien-Yu Lee, J. Cook, 2001 .