Joke De Messemaeker

Sn whisker evaluations in 3D microbumped structures

Geert Willems, Ingrid De Wolf, David Schaubroeck, 2014, Microelectron. Reliab..

Reliability Challenges Related to TSV Integration and 3-D Stacking

Eric Beyne, Wei Guo, Ingrid De Wolf, 2016, IEEE Design & Test.

Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

Eric Beyne, Christopher J. Wilson, Ingrid De Wolf, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Ingrid De Wolf, Riet Labie, Bert Verlinden, 2012, Microelectron. Reliab..

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Eric Beyne, Luka Kljucar, Ingrid De Wolf, 2017, Microelectron. Reliab..

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2015, 2015 IEEE International Reliability Physics Symposium.

Growth of Millimeter-Sized Graphene Single Crystals on Al2O3(0001)/Pt(111) Template Wafers Using Chemical Vapor Deposition

Cedric Huyghebaert, Stefan De Gendt, Steven Brems, 2018 .

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Eric Beyne, Ingrid De Wolf, Joeri De Vos, 2014 .

Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices

Eric Beyne, Ingrid De Wolf, Joeri De Vos, 2015 .