N. Lian

Pre-Epitaxial Plasma Etch Treatment for the Selective Epitaxial Growth of Silicon in High Aspect Ratio 3D NAND Memory

Chih-Yuan Lu, Hong-Ji Lee, Nan-Tzu Lian, 2019, 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Study of Plasma Arcing Mechanism in High Aspect Ratio Slit Trench Etching

Chih-Yuan Lu, Tahone Yang, Kuang-Chao Chen, 2019, 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Impact of Asymmetric Memory Hole Profile on Silicon Selective Epitaxial Growth in 3D NAND Memory : AEPM: Advanced Equipment Processes and Materials

Chih-Yuan Lu, Tahone Yang, Kuang-Chao Chen, 2020, 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Effects of BCl3 gas on physical damage and Al residues in oxide hard-mask-based Al etching

K. C. Chen, M. Deng, H. Lee, 2007 .

Asymmetric etching profile control during high aspect ratio Plasma etch

Chih-Yuan Lu, Tahone Yang, Kuang-Chao Chen, 2018, Advanced Semiconductor Manufacturing Conference.

Oval-Shaped OP-Layer Hole Etching: Shape Deformation, Local Arcing, and Hole Bridging Improvements

Chih-Yuan Lu, Tahone Yang, Kuang-Chao Chen, 2020, 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Pattern dependent plasma charging effect in high aspect ratio 3D NAND architecture

Zusing Yang, Sheng-Yuan Chang, Hong-Ji Lee, 2016, 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Investigation of shape etching on multi-layer SiO2/poly-Si for 3D NAND architecture

Chih-Yuan Lu, Zusing Yang, Hong-Ji Lee, 2013, ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.