Lucas Blanc
发表
F. Parrain,
A. Bosseboeuf,
M. Woytasik,
2020,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
F. Parrain,
A. Bosseboeuf,
M. Woytasik,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).