Hu Sheng

发表

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Kang Yi, Ren Qiwei, S. Hongbin, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).