Song Liu

Through-Silicon Capacitor Interconnection for High-Frequency 3-D Microsystem

Yintang Yang, Qijun Lu, Guangbao Shan, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

An anisotropic thermal-stress model for through-silicon via

Song Liu, Guangbao Shan, Guangbao Shan, 2018 .

The modeling of DC current crowding for Through-silicon Via in 3-D IC

Guangbao Shan, Long-Sheng Wu, Song Liu, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).