Li Jiang

On effective TSV repair for 3D-stacked ICs

Qiang Xu, Li Jiang, Bill Eklow, 2012, 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE).

On Workload-Aware DRAM Failure Prediction in Large-Scale Data Centers

Xin Li, Cheng He, Yu Li, 2021, 2021 IEEE 39th VLSI Test Symposium (VTS).

A Low-Cost TSV Test and Diagnosis Scheme Based on Binary Search Method

Qiang Xu, Xiaolong Zhang, Li Jiang, 2015, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

On effective and efficient in-field TSV repair for stacked 3D ICs

Qiang Xu, Fangming Ye, Krishnendu Chakrabarty, 2013, 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC).

On Effective Through-Silicon Via Repair for 3-D-Stacked ICs

Qiang Xu, Li Jiang, Bill Eklow, 2013, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Fault-Tolerant 3D-NoC Architecture and Design: Recent Advances and Challenges

Qiang Xu, Li Jiang, Q. Xu, 2015, NOCS.

Modeling TSV open defects in 3D-stacked DRAM

Qiang Xu, Yuan Xie, Lian Duan, 2010, 2010 IEEE International Test Conference.

EXPERT: EXPloiting DRAM ERror Types to Improve the Effective Forecasting Coverage in the Field

Qiang Xu, Ming-Chang Yang, Xiangjun Peng, 2023, 2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume (DSN-S).

On test syndrome merging for reasoning-based board-level functional fault diagnosis

Qiang Xu, Zhaobo Zhang, Li Jiang, 2015, The 20th Asia and South Pacific Design Automation Conference.

AppealNet: An Efficient and Highly-Accurate Edge/Cloud Collaborative Architecture for DNN Inference

Ye Tian, Qiang Xu, Min Li, 2021, 2021 58th ACM/IEEE Design Automation Conference (DAC).

A novel TSV probing technique with adhesive test interposer

Qiang Xu, Li Jiang, Chao Li, 2015, 2015 33rd IEEE International Conference on Computer Design (ICCD).