Teng Kong
发表
Y. Sui,
Yezeng He,
Qingkun Meng,
2019,
Journal of Materials Research.
Y. Sui,
F. Wei,
Zhi Sun,
2021,
Journal of Materials Science: Materials in Electronics.
Y. Sui,
Qingkun Meng,
F. Wei,
2023,
Journal of Alloys and Compounds.