H. Yamamoto

Spike Annealing as Second Rapid Thermal Annealing to Prevent Pure Nickel Silicide From Decomposing on a Gate

T. Futase, Y. Inaba, T. Kamino, 2009, IEEE Transactions on Semiconductor Manufacturing.

${\rm TiCl}_{4}$ Soak on NiSi: Selective Formation of Pure Sub-Nanometer NiTi to Reduce Contact Resistance

H. Tanimoto, T. Futase, N. Hashikawa, 2011, IEEE Transactions on Semiconductor Manufacturing.

Process integration of single-wafer technology in a 300-mm fab, realizing drastic cycle time reduction with high yield and excellent reliability

Y. Sasaki, Michimasa Funabashi, K. Nemoto, 2003 .