C. Cavalcante

28nm FDSOI CMOS technology (FEOL and BEOL) thermal stability for 3D Sequential Integration: yield and reliability analysis

X. Garros, O. Rozeau, G. Ghibaudo, 2020, 2020 IEEE Symposium on VLSI Technology.

A Review of Low Temperature Process Modules Leading Up to the First (≤500 °C) Planar FDSOI CMOS Devices for 3-D Sequential Integration

C. Fenouillet-Béranger, F. Andrieu, X. Garros, 2021, IEEE Transactions on Electron Devices.