Robert Darveaux

Board level reliability of BGA multichip modules

Robert Darveaux, Bhuvaneshwaran Vijayakumar, 2017, 2017 Pan Pacific Microelectronics Symposium (Pan Pacific).

BGA Reliability in Automotive Underhood Applications

Robert Darveaux, Nokibul Islam, Pradeep Lall, 2003 .

Cast circuit loetballgitter with flexible manufacturing processes and

Robert Darveaux, Bruce J. Freyman, 1997 .

Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization

Robert Darveaux, Jimmy-Dinh V. Hoang, Tony Lobianco, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies

Robert Darveaux, 2012 .

Packaging of image sensor devices for camera module applications - Keynote Speaker

Robert Darveaux, 2004 .

Damage Relationships for BGA Reliability in Harsh Environments

Robert Darveaux, Nokibul Islam, Pradeep Lall, 2003 .

Fine Pitch (150µm) Pb-free Flip Chip Bumping & Packaging

Robert Darveaux, Jason Chang, Lou Nicholls, 2006 .