Barbara Charlet

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly

Roberto Guerrieri, Roberto Canegallo, Alberto Fazzi, 2007, IEEE Journal of Solid-State Circuits.

Enabling technologies for3DSystem on Chip(SoC) integration andexamples of3D integrated structures.

Barbara Charlet, P. Leduc, 2007 .

System on Wafer: A New Silicon Concept in SiP

Maud Vinet, Alan Mathewson, Léa Di Cioccio, 2009, Proceedings of the IEEE.

Recent results on advanced molecular wafer bonding technology for 3D integration on silicon

Maud Vinet, N. Kernevez, Philippe Regreny, 2005 .

3-D Integration Latest Developments at LETI

Barbara Charlet, 2006 .

Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration

Roberto Guerrieri, M. Zussy, Roberto Canegallo, 2006 .