Daehyun Chung

Electrical-thermal co-analysis for power delivery networks in 3D system integration

Lijun Jiang, Madhavan Swaminathan, Jianyong Xie, 2009, 2009 IEEE International Conference on 3D System Integration.

Electrical modeling of Through Silicon and Package Vias

Madhavan Swaminathan, Daehyun Chung, Rao R. Tummala, 2009, 2009 IEEE International Conference on 3D System Integration.

Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines

Madhavan Swaminathan, Daehyun Chung, Suzanne Huh, 2009, 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).

Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines

Madhavan Swaminathan, Daehyun Chung, Suzanne Huh, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.