Barry J. Rubin

Electrical-thermal co-analysis for power delivery networks in 3D system integration

Lijun Jiang, Madhavan Swaminathan, Jianyong Xie, 2009, 2009 IEEE International Conference on 3D System Integration.

Electrical characterization of the interconnects inside a computer

Barry J. Rubin, 1991 .

Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies

Kaustav Banerjee, Lijun Jiang, Alina Deutsch, 2009, 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers.

A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis

Gerard V. Kopcsay, Alina Deutsch, Barry J. Rubin, 2002, IEEE Trans. Very Large Scale Integr. Syst..

and for Printed Circuit Board Insulators Up to 30 GHz Using the Short-Pulse Propagation Technique

Gerard V. Kopcsay, Alina Deutsch, Barry J. Rubin, 2005 .

When are transmission-line effects important for on-chip interconnections?

Keith A. Jenkins, Robert H. Dennard, Gerard V. Kopcsay, 1997 .

A CAD methodology and tool for the characterization of wide on-chip buses

Gerard V. Kopcsay, Alina Deutsch, Barry J. Rubin, 2005 .

Modeling and characterization of long on-chip interconnections for high-performance microprocessors

Robert H. Dennard, Gerard V. Kopcsay, Alina Deutsch, 1995, IBM Journal of Research and Development.

IBM Intelligent Bricks project - Petabytes and beyond

Winfried W. Wilcke, James Lee Hafner, Barry J. Rubin, 2006, IBM J. Res. Dev..